Stress-engineered frangible structures
US10012250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Oct 13, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B17/10137
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.