Method for manufacturing an inductive conductivity sensor and an inductive conductivity sensor
US10012608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2015 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Aug 12, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing an inductive conductivity sensor, with coils on both sides of a circuit board are placed surrounding an opening of the circuit board. The circuit board with the coils is inserted into a housing, wherein a sleeve is inserted in the housing through a second opening of the housing through the opening of the circuit board out to a first opening. The first opening, the second opening and the opening of the circuit board are aligned with one another, wherein the sleeve includes a first end section and a second end section and the sleeve is inserted with the first end section first in the housing, and wherein the sleeve is welded with the housing by means of a sonotrode by ultrasonic welding. The first end section of the sleeve is welded with the housing and with a counterpart inserted into the first opening. The invention relates further to an inductive conductivity sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.