Three-dimensional integrated photonic structure with improved optical properties
US10012792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Jul 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated electronic device includes a substrate having an opening extending therethrough. The substrate includes an interconnection network, and connections coupled to the interconnection network. The connections are to be fixed on a printed circuit board. An integrated photonic module is electrically connected to the substrate, with a portion of the integrated photonic module in front of or overlapping the opening of the substrate. An integrated electronic module is electrically connected to the photonic module, and extends at least partly into the opening of the substrate. The electronic module and the substrate may be electrically connected onto the same face of the photonic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.