Assembly body for micromirror chips, mirror device and production method for a mirror device

US10012828B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Schatz · Kornwestheim, DE
• Friedjof Heuck · Stuttgart, DE
• Kerrin Doessel · Stuttgart, DE
• Stefan Pinter · Reutlingen, DE
• Daniel Pantel · Ditzingen, DE
• Franziska Rohlfing · Leonberg, DE

Key dates

• Filing date: Apr 27, 2015
• Grant date: Jul 3, 2018
• Expiry date: Jul 7, 2035

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B26/101
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.