Device substrate and fabricating method thereof
US10012905B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 25, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Sep 25, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13396
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device substrate and a fabricating method thereof are provided. The device substrate includes a substrate and a patterned light-shielding layer. The patterned light-shielding layer having a plurality of pixel openings and a plurality of first exposure openings is disposed on the substrate, and an area and/or shape of one of the first exposure openings is different from an area and/or shape of one of the pixel openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.