Downhole imaging techniques using lamination analysis
US10013748B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Sep 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/20056
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the disclosure involve a method comprising computing a true stratigraphic thickness (“TST”) index based on one or more dynamic images, one or more measurement images, or combinations thereof. Computing the TST index comprises outputting a dynamic image value channel comprising a median value on each depth of the one or more dynamic images, a dynamic normalized image value channel comprising a normalization of the dynamic image value channel, a measurement image value channel comprising a median value on each depth of the measurement image, and the TST index. The method also involves computing a decomposition channel based on the TST, extracting lamination boundaries from the dynamic image value channel based on the decomposition channel, and computing the lamination properties based on the lamination boundaries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.