Methods for processing electronic devices
US10014177B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2013 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Jan 31, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.