Magnetic wafer gripper
US10014201B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Dec 16, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are described for transferring wafers between processing steps in the fabrication of solar cells. The wafers may be processed using a cluster tool including a load-lock, a plurality of processing modules, and a central robot to transfer wafers between the plurality of modules. Each module may include a pedestal including wafer recesses to support the wafers, and puck recesses for supporting ferromagnetic pucks below the wafers. The central robot includes electromagnets for attracting the ferromagnetic pucks toward the electro magnets in order to clamp the wafers between the ferromagnetic pucks and the electromagnets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.