Method for realizing ultra-thin sensors and electronics with enhanced fragility
US10014204B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
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Key dates
| Filing date | Jul 11, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Jul 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.