Circuit board and smart card module and smart card utilizing the same
US10014249B2 · kind B2 · utility
1Cited by
66References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2017 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Feb 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component. The pad region comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the traces comprises an extension which extends along a perimeter of the pad region. The present invention provides a reliable adhesion between the chip and pad region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.