Hyperfrequency housing occupying a small surface area and mounting of such a housing on a circuit
US10014264B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2015 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Nov 18, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of the cavity, the exterior connection elements able to interconnect with an exterior circuit such that the side wall faces the exterior circuit when the exterior connection elements are interconnected with the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.