Compensation of bondwires in the microwave regime
US10014276B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2015 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Nov 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.