Method for fabricating array substrate, array substrate and display device
US10014326B2 · kind B2 · utility
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Key dates
| Filing date | Mar 25, 2013 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Mar 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/451
Abstract
A method for fabricating an array substrate, an array substrate and a display device are provided. The method for fabricating the array substrate includes: forming a spacer layer on the array substrate, the spacer layer is disposed under a planarized layer and corresponds to a location of a via hole in the planarized layer, wherein the planarized layer is formed of a hot melt material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.