Multilayer electronic structures with embedded filters
US10014843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2013 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Aug 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter;the at least one capacitor being sandwiched between the at least one feature layer and at least one via in said at least adjacent via layer, such that the at least one via stands on the at least one capacitor, and the at least one of the first feature layer and the adjacent via layer includes at least one inductor extending in the XY plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.