Two-step, direct-write laser metallization
US10015887B2 · kind B2 · utility
3Cited by
22References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Jun 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1484
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.