Method and device for fitting inserts by bonding by way of controlled polymerization
US10016964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2014 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | May 3, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device and a method intended to fit an insert in an orifice formed in a structure. The device is a fitting vehicle comprising the insert to be fitted, a polymerizable adhesive, and an applicator. The applicator comprises: an open enclosure in which the insert and the adhesive can be held; deployment means that are able to push back the insert and the adhesive out of the open enclosure so as to allow the insert to be fitted in the orifice in the structure. The fitting vehicle is configured to allow the polymerization of the adhesive held in the open enclosure of the applicator to be initiated. Advantageously, the adhesive is microencapsulated in the form of microcapsules of resin and hardener; the step of polymerization of the adhesive being initiated by rupturing of the microcapsules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.