Resin composition, prepreg and laminate board
US10017601B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 24, 2014 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jun 24, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5399
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.