Epoxy-resin composition for fiber-matrix semifinished products
US10017614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2014 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Sep 15, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The fiber-matrix-semifinished-product composition can be produced via mixing of the constituents, whereupon the composition thickens. The resultant thickened product (semisolid fiber-matrix semifinished product) features comparatively short maturing time and comparatively…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.