Composition for forming silica layer, method for manufacturing silica layer, and electric device including silica layer
US10017646B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jul 21, 2017 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jul 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02318
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. η=k·Ma [Equation 1]In Equation 1,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.