Resin composition, and prepreg and laminated sheet using the same
US10017660B2 · kind B2 · utility
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Key dates
| Filing date | May 31, 2011 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | May 31, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B)wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.