Downhole distributed sensor arrays for measuring at least one of pressure and temperature, downhole distributed sensor arrays including at least one weld joint, and methods of forming sensors arrays for downhole use including welding
US10018033B2 · kind B2 · utility
4Cited by
34References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Mar 7, 2036 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/017
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A downhole sensor array includes sensor housings, and each sensor housing contains one or more of a pressure sensor and a temperature sensor. Cable segments connect the sensor housings. A weld joint bonds a sensor housing to a jacket of a cable segment, and a conductor of the cable segment and the jacket of the cable segment may be separated by a void proximate the weld joint. Methods relate to forming such sensor arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.