Optical module and manufacturing method thereof
US10018794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Apr 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.