Photosensitive resin composition, wavelength conversion substrate and light emitting device
US10018912B2 · kind B2 · utility
1Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jun 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A photosensitive resin composition includes a positive photosensitive resin having a photosensitive moiety that cleaves upon exposure to light, and a wavelength conversion material dispersed in the photosensitive resin. The photosensitive resin and the wavelength conversion material meet (i) to (iv):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.