Multi-layer injection molded device housings
US10019029B1 · kind B1 · utility
11Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Mar 7, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A housing for an electronic device includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly includes a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer includes a high reinforcing agent content percentage to provide increased stiffness, and the second injection molded layer includes a low reinforcing agent content percentage, which provides less structural support than the first injection molded layer, but an improved aesthetic appearance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.