Immersion cooling arrangements for electronic devices
US10020242B2 · kind B2 · utility
31Cited by
22References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Apr 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20236
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.