Tape for electronic devices with reinforced lead crack
US10020248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | May 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.