Cooling structure for photoelectric conversion element
US10020407B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 6, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jul 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This cooling mechanism for a surface-mounted-type photoelectric conversion element is provided on a circuit board to which a surface-mounted-type photoelectric conversion element, which has a signal terminal that is connected to inner wiring and a terminal for fixation that is not connected to the inner wiring on a back surface thereof, is mounted, the cooling mechanism has a front-surface-side copper foil pattern to which the terminal for fixation is connected, a back-surface-side copper foil pattern, and a through-hole via which connects the copper foil patterns, a cooling member which is fixed to the circuit board so as to have contact with the back-surface-side copper foil pattern, and which cools the back-surface-side copper foil pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.