Integrated speakers
US10021480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2014 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.