Metal-laminated polyimide substrate, and method for production thereof
US10021789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2008 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jun 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer. A laminated polyimide substrate comprises a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.