Cooling apparatus for computer memory
US10021814B2 · kind B2 · utility
10Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Sep 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.