Apparatus for disassembling electronic component from circuit board
US10021820B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 8, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Apr 13, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.