Polishing pad, polishing apparatus and method for manufacturing polishing pad
US10022836B2 · kind B2 · utility
1Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2015 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Sep 8, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0027
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.