Bonded patches with bond line control
US10022922B2 · kind B2 · utility
1Cited by
36References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2014 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | May 1, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3076
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.