Devices for substrate adhesion
US10022937B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2014 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Apr 15, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B7/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This disclosure describes methods and devices useful for adhering a first substrate of a display to a second substrate of the display. In example embodiments, a first plate may be sealed to the first substrate, and a second plate may be sealed to the second substrate. In addition, a layer of adhesive may be disposed between the first and second substrates to assist in adhering the first substrate to the second substrate. A pressure may then be applied to the first and second plates as well as the first and second substrates to assist in the adhesion process. In example embodiments, the first plate may assist in applying pressure proximate a perimeter of the first substrate such that the perimeter of the first substrate adheres to a perimeter of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.