Liquid ejection head, liquid ejection apparatus, and manufacturing method
US10022979B2 · kind B2 · utility
9Cited by
17References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2016 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/21
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.