Hot melt adhesive composition

US10023771B2 · kind B2 · utility

Assignee

• DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

• Yi Jin · Irvine, US
• Kim L. Walton · Lake Jackson, US
• Gary R. Marchand · Lake Jackson, US
• Selim Yalvac · Midland, US
• Allan Walter Mclennaghan · Lachen, CH
• Kate R. Brown · Houston, US
• Carl N. Iverson · Houston, US
• Cynthia L. Rickey · Lake Jackson, US

Key dates

• Filing date: Aug 20, 2015
• Grant date: Jul 17, 2018
• Expiry date: Aug 20, 2035

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J123/12
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The present disclosure provides a composition. In an embodiment an adhesive composition is provided and includes A) a propylene based plastomer or elastomer (PBPE) comprising up to 10 wt % units derived from ethylene and having (i) a Koenig B-value less than 1.0; (ii) a total unsaturation per mole of propylene from 0.01% to 0.03%; (iii) a density from 0.870 g/cc to 0.890 g/cc; (iv) a melt viscosity at 177° C. from 800 mPa·s to 11,000 mPa·s; and (v) a weight average molecular weight from 20,000 to 50,000 g/mol; B) a tackifier; and C) a wax.