Method of making a plate package for a plate heat exchanger
US10024602B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2013 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Mar 12, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49366
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A plate package made according to the method includes first heat exchanger plates and second heat exchanger plates. Each heat exchanger plate has a first porthole, and the port hole of at least one of the heat exchanger plates is surrounded by a peripheral rim. The first heat exchanger plates and the second heat exchanger plates, are joined to each other and arranged side by side in such a way that the peripheral rims together define an inlet channel extending through the plate package. The peripheral rim of the first and/or the second heat exchanger plates has at least one through hole, forming a fluid passage allowing a communication between the inlet channel and the first plate interspaces. The at least one through hole is made in a condition in which the first and the second heat exchanger plates have been joined to each other to form the plate package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.