Method of manufacturing an electronic component
US10026549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2014 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Mar 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic component includes: a coil forming step of forming a winding coil by a wire-shaped conductor; a press fitting step of embedding the winding coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed; a covering step of covering a part of the winding coil with another plate-shaped composite magnetic material that is softened, the part of the coil being a part remaining uncovered in the press fitting step; a pressurizing step of pressurizing and molding an entirety; and, a hardening step of hardening the composite magnetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.