Method and system for applying materials on a substrate
US10026617B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2016 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Sep 16, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.