Device comprising an encapsulation unit
US10026625B2 · kind B2 · utility
4Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2014 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | May 24, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device that includes a component and an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen, wherein the encapsulation arrangement has a first layer and thereabove a second layer on at least one surface of the component, the first layer and the second layer each comprise an inorganic material, and the second layer is arranged directly on the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.