Power module
US10026670B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Oct 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes: a relay substrate including a first conductor layer provided on a front surface and a second conductor layer provided on a back surface; copper blocks provided in holes penetrating through the relay substrate in a thickness direction and connecting the first conductor layer to the second conductor layer; semiconductor devices wherein each semiconductor device includes a main electrode provided at a location facing an end face of the corresponding copper block and only one copper block is electrically connected to one main electrode; an insulating substrate connected to back-surfaces of the semiconductor devices via joining materials; and a sealer sealing the relay substrate, the copper blocks, and the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.