Semiconductor device
US10026677B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2016 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Aug 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/17747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device that includes a first die pad, an adhesive, and a second die pad fixed to the top surface of the first die pad via the adhesive. The second die pad includes a body portion and a protrusion portion provided on a side surface of the body portion. A semiconductor chip is fixed to a top surface of the second die pad, and a lead is electrically connected to the semiconductor chip. The semiconductor device further includes a package material that covers the first die pad, the second die pad, the semiconductor chip, and the lead. The first die pad is substantially as thick as the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.