Electronic assemblies including electronic devices mounted on non-planar subrates
US10026719B2 · kind B2 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2015 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Jan 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1076
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electronic assemblies described in this specification are characterized by a non-planar low-temperature co-fired ceramic substrate on which an electronic device is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.