Method of manufacturing a sensor array
US10026863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2017 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Apr 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/413
Abstract
A method of manufacturing a sensor array includes providing a carrier glass substrate, forming an amorphous silicon layer over the carrier glass substrate, forming a first heat buffer layer over the amorphous silicon layer; forming a mirror layer over the first heat buffer layer; forming a second heat buffer layer over the mirror layer; forming a flexible substrate over the second heat buffer layer; and forming an active device layer over the flexible substrate. The method of the present invention further comprises exposing the sensor array to light from a flash lamp and then detaching the carrier glass substrate from the sensor array. The method of the present invention optionally further comprises filtering the light from the flash lamp to wavelengths below 350 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.