Multilayer wiring plate and method for fabricating same
US10027012B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2014 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Apr 10, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring plate includes a coaxial wire includes a signal line, an insulation coating and an outer peripheral conductor. An insulating layer is arranged on an inner or outer layer side. A metal film circuit is arranged by the intermediary of the insulating layer, and the metal film circuit and the outer peripheral conductor and signal line of the coaxial wire are connected. A signal line connection part that connects the signal line to the metal film circuit includes a penetration hole A that passes through the insulating layer and the outer peripheral conductor; the coaxial wire from which the outer peripheral conductor is removed inside the penetration hole A; a hole filling resin filled inside the penetration hole A; a penetration hole B that passes through the hole filling resin and the signal line; and a plated layer arranged on an inner wall of the penetration hole B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.