Immersion cooling arrangements
US10028409B1 · kind B1 · utility
23Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2017 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Jan 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An immersion cooling arrangement includes a housing containing a liquid coolant. An electrical device is submerged within the liquid coolant. A printed wiring board is seated on the housing and separates the coolant from the environment external to the housing to provide penetration-free electrical communication between a power source and the electrical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.