Heat dissipating system for data center
US10028416B2 · kind B2 · utility
1Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2015 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | May 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating system for a data center includes a data center and an air processing unit. The data center includes an enclosure and an electronic device, and defines a first air vent and a second air vent. The air processing unit includes a case and an air processing device. The case defines a first air inlet, a second air inlet, and a first air outlet. At least one air inlet damper is mounted on the case, and a first return air damper is mounted in the case. The data center can adjust cooling based on ambient temperature through the air inlet damper and the first return air damper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.