Molded printhead
US10029467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2013 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Sep 27, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.