Laser-separated edges with controlled roughness
US10029940B1 · kind B1 · utility
4Cited by
1References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 4, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Aug 14, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/53
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The roughness of a separation surface formed along a process path along which a plurality of laser-induced channels is formed in a substrate can be controlled through process parameters. Laser pulse power can be varied to vary the resulting roughness. Higher laser pulse power can form larger laser-induced channels, enabling larger inter-channel spacing and/or higher roughness in applications where it is desired. Lower laser pulse power can be employed to achieve smoother separation surfaces when desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.