High thermal conductivity thermoplastic resin composition with excellent injection moldability
US10030138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2014 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jul 1, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A highly thermally conductive thermoplastic resin composition of the present invention contains: (A) a thermoplastic polyester resin having a weight average molecular weight of 50,000 to 200,000; (B) a polyalkylene terephthalate block copolymer composed of a polyether segment and a polyethylene terephthalate segment which includes an ethylene terephthalate unit as a main component; and (C) a highly thermally conductive inorganic compound, the highly thermally conductive thermoplastic resin composition containing, with respect to 100 parts by weight of (A) the thermoplastic polyester resin, 20 parts by weight to 200 parts by weight of (B) the polyalkylene terephthalate block copolymer and 20 parts by weight to 250 parts by weight of (C) the highly thermally conductive inorganic compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.